Your Partner In Contract Electronics
Manufacture And Design, since 1989
"Quality Endures long after price is forgotten"

Tel: 0161 947 8000

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Electronics Jargon

 

TQFP
(Thin Quad Flat Package)
QFP
(Quad Flat Package)
QSOP
(Quarter-Size Small Outline Package)
TSSOP
(Thin Small Shrink Outline Package)
LF-BGA
(Low Profile Ball Grid Array
TF-BGA
(Thin Fine Ball Grid Array)
SSOP
(Small Shrink Outline Package)
FLEX-BGA
(Flexible Ball Grid Array)
PLCC
(Plastic Leaded Chip Carrier)
QFN
(Quad Flat No-Leads)
LQFP
(Low Quad Flat Pack)
LBGA
(Low Profile Fine Pitch Ball Grid Array)
VF-BGA
(Very Fine Pitch Ball Grid Array)

 

 

 

 

 

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© Assembly Contracts Ltd Manchester UK 2007

Site Last Update : Sunday, August 26, 2007

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